With the arrival of new components related to miniaturisation (BGA, LGA, QFN, DFN housings) including internet connected objects (IOT), a traditional microscope inspection or AOI is not the best solution since most solder connections are hidden.
The use of X-rays is a must. The equipment must be up to the requirement, allowing for flexibility of use, data processing, and an ability to correctly discriminate the elements, so as to have a relevant analysis.
The X-ray system (160K), equipped with an optional “laminography” which lets you reproduce a 3D model of the component under inspection without destroying the board.
This X-ray analysis is offered with our manufacturing from the prototype stage, and is available on pre-production and mass production if there is a requirement.